21
Jan
10:18
BYD Semiconductor to go public independently
The Growth Enterprise Market Listing Committee of Shenzhen Stock Exchange has announced that the IPO of BYD Semiconductor, a current subsidiary of BYD (HK), is scheduled for 27 January.
According to the prospectus, the fundraising amount is planned to be CNY 2 billion ($315.43 million) and the capital will be used for R&D projects of power semiconductor technologies, high-performance MCU chip design and testing technologies, and high-precision BMS c…
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Anonymous
Very good overview of the weekly steel market.
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